Volume 40, Issue 3 (Journal of Advanced Materials-Fall 2021)                   2021, 40(3): 29-42 | Back to browse issues page

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Mohagheghpour E, Gholamipour R, Rajabi M, Mojtahedzadeh Larijani M. STUDY OF STRUCTURAL EVOLUTION OF AMORPHOUS CARBON FILMS ON Ni-Cu ALLOY AND ITS CORRELATION WITH DEPOSITION TEMPERATURE AND ION BEAM ENERGY. Journal of Advanced Materials in Engineering (Esteghlal) 2021; 40 (3) :29-42
URL: http://jame.iut.ac.ir/article-1-1162-en.html
STUDY OF STRUCTURAL EVOLUTION OF AMORPHOUS CARBON FILMS ON Ni-Cu ALLOY AND ITS CORRELATION WITH DEPOSITION TEMPERATURE AND ION BEAM ENERGY
E. Mohagheghpour * , R. Gholamipour , M. Rajabi , M. Mojtahedzadeh Larijani
Radiation Applications Research School, Nuclear Sciences and Technology Research Institute, 14395836, Tehran, Iran , emohaghegh@aeoi.org.ir
Abstract:   (1879 Views)
In this study, the amorphous carbon thin films were deposited by ion beam sputtering deposition method on the glass and Ni–Cu alloy substrates. The structural evolution of amorphous carbon and its correlation with the kinetic energy of carbon atoms during the growth of thin film was investigated. The effect of substrate material, deposition temperature, and ion beam energy on the structural changes were examined. Raman spectroscopy indicated a structural transition from amorphous carbon to diamond-like amorphous carbon (DLC) due to an increase in deposition temperature up to 100°C and ion beam energy from 2 keV to 5 keV. The size of graphite crystallites with sp2 bonds (La) were smaller than 1 nm in the amorphous carbon layers deposited on Ni-Cu alloy. The results of residual stress calculation using X-ray diffractometer (XRD) analysis revealed a decreasing trend in the tensile residual stress values of the amorphous carbon thin films with increasing the ion beam energy.
Keywords: Thin Film, Amorphous Carbon, Ion Beam Energy, Deposition Temperature, Structural Evolution.
Full-Text [PDF 787 kb]   (654 Downloads)    
Type of Study: Research | Subject: Surface engineering and coatings
Received: 2021/04/18 | Accepted: 2021/08/20 | Published: 2021/11/1
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