S. Ghaderi, F. Karimzadeh, A. Ashrafi,
Volume 5, Issue 2 (1-2020)
Abstract
In the present study, the effect of time and base metal microstructure on the Transient Liquid Phase (TLP) bonding of 304L stainless steel was studied. TLP was performed at 1050 0C for 5 and 60 minutes on the coarse grain austenitic and martensitic microstructure using BNi-2 interlayer. To prepare martensitic microstructure, as-received 304L was rolled at -15 0C up to 80% rolling reduction. TEM analysis was proved that the microstructure of 80% rolled samples consisted of two different morphologies of martensite namely as lath-type and dislocation cell type martensite. It was observed that the structure of bonded zone after 5 min has consisted of isothermally solidified zone (ISZ) containing γ solid solution and athermally solidified zone (ASZ) containing complex boride phases. Meanwhile, after 60 min of heating, the structure of bonded zone completely solidifies isothermally. The obtained results also showed that the martensitic microstructure considerably effect on the width of diffusion affected zone (DAZ) which was related to the reversion of martensite to ultrafine grain austenite during heating.
S. A. Beheshti Bafqi, M. Mosallaee,
Volume 6, Issue 2 (12-2020)
Abstract
In the present study, the transient liquid phase bonding of AISI 2205 dual phase stainless steel with amorphous BNi-3 interlayer was carried out. Based on the initial experimental and analytical studies, the parameters of temperature and bonding time were determined. In order to investigate the effect of bonding temperature on the microstructural changes of the joint, bonding was performed in the temperature range of 1050-1200℃ for 20 min. The microstructural and phase analyses indicated the completion of isothermal solidification and the formation of a uniform Ni-solid solution in the bonding zone centerline. The interdiffusion between the bonding zone and the adjacent base metal resulted in the formation of boride and nitride intermetallic compounds in the base metal adjacent to the bonding zone, which the area fraction of this intermetallics significantly decreased with increasing bonding temperature from 1050℃ to 1200℃ (reduction of the intermetallic area fraction from 85% to 40%). Evaluation of shear strength of samples showed that despite the completion of isothermal solidification in all samples and shear strength of bonded samples significantly depends of amount and morphology of intermetallic compounds on the transient liquid phase bonding shear strength. By increasing the bonding temperature to 1200℃ and reducing the area fraction of intermetallic compounds up to 40% of the shear strength of the samples increased from 450 MPa of TLP bonded specimen of 1050℃ to about 85% of base metal shear strength.
