A. Amirkhani, B. Beidokhti, K. Shirvani,
Volume 11, Issue 2 (12-2025)
Abstract
In this study, a novel two-step heating strategy was investigated for transient liquid-phase (TLP) bonding of the IN-738LC superalloy. The bonding process consisted of an initial heating at 1150 °C for 5 seconds, followed by holding at 1110–1130 °C for 3 to 40 minutes. The microstructural evolution during the process, as well as the interface morphology, was characterized and compared with conventional TLP joints. This approach significantly reduced the time required to complete isothermal solidification; the width of the central eutectic zone decreased from 45 µm at 3 minutes to 19 µm at 12 minutes, and the eutectic zone was completely eliminated after 40 minutes. Microstructural examinations revealed that the initial step of the two-step heating process produced a cellular–dendritic solidification interface, leading to a non-uniform distribution of porosity along the bond region. Subsequent homogenization removed boride precipitates and resulted in the formation of uniformly distributed γ′ precipitates similar to those in the base metal. These findings provide practical and microstructural insights into the influence of thermal profiles on interfacial evolution and offer a pathway for improving joint quality in nickel-based superalloys.
