Journal of Welding Science

This study aimed to investigate the effect of diffusion welding parameters on the microstructural characteristics and mechanical properties of the dissimilar joint between AISI 418 stainless steel and Inconel 738 superalloy using Ni interlayer with a thickness of 50 µm. The experiments were performed in a vacuum furnace at three temperatures of 1000, 1050 and 1150 °C for 45, 60, 75 and 90 min under the pressure of 5 MPa.The results show that voids and non-bonded areas are seen in the samples that were bonded at a lower temperature (1000 °C). By increasing the joining temperature from 1000 °C to 1050 °C, all micro discontinuities have disappeared, which shows that the microplastic deformation of roughness has improved. Then, by increasing the temperature to 1150 °C,non-bonded areas are observed in the joint due to the reduction of pressure on the contact surfaces. When pure nickel is used as an interlayer, intermetallic compounds of
γ' [Ni3(Al, Ti)] are formed in the γ matrix phase on the side of Inconel 738 superalloy while compounds of FeNi3 and γ (γFe, Ni) are formed on the side of AISI 418 stainless steel. According to the results of line scan analysis, the slope and penetration of elements in Inconel 738 superalloy is lower than AISI 418 stainless steel , which indicates less penetration in Inconel 738 superalloy. In the sample welded at the temperature of 1050 °C and the time of  90 Min, the penetration value of the nickel interlayer in AISI 418 stainless steel  and Inconel 738 superalloy was 40 µm and 35 µm, respectively. By comparing the maximum hardness, it can be concluded that the joint at the temperature of 1050 °C and the time of 90 Min has a lower maximum hardness than other samples. Therefore, it has better joint characteristics than other samples in terms of intermetallic compounds. The highest value of shear strength was obtained at the temperature of 1050 °C and the time of 90 Min, which is equal to 270 MPa.

The present study focuses on optimizing the mechanical properties and microstructure of laser welding in Haynes 25 (L-605) cobalt-based superalloy. Initially, the influence of laser welding variables such as laser power, pulse frequency, welding speed, and pulse width on the mechanical and metallurgical properties of the weld joints is investigated. By examining the welding variables, the values of G (thermal gradient) and R (cooling rate) are calculated, and their ratio (G/R) and cooling rate (G×R), which predominantly affect the solidification microstructure, are determined. The structural correlation with the mechanical properties resulting from welding is examined.  In this research, it is considered to obtain the welding variables to create a high percentage of the structure in the form of equiaxed dendrite. Microstructural analysis reveals the growth of equiaxed grains and dendritic structures in the weld zone. The high cooling rate in the weld pool leads to dendritic solidification starting from columnar dendrites at the weld walls and ending in equiaxed dendrites at the center of the weld. The microhardness value in the weld zone is HV 328, which is very close to the microhardness of the base material. The tensile strength of the weld samples reaches about 93% to 94% of the base metal tensile strength. Tensile testing of the weld samples indicates a ductile-brittle fracture. Examination of the scanning electron microscope confirms the presence of dimples, intergranular cracks, and microvoids in the fracture zone.

In this study, the microstructure of the joint interface in three-layer explosive welding of austenitic stainless steel 321 - aluminum 1050 - aluminum 5083 was examined before and after heat treatment. The welded samples were subjected to heat treatment at temperatures of 250°C and 350°C for durations of 1000, 3000, and 10000 seconds. Microstructural analysis was performed using optical microscopy and scanning electron microscopy. The results revealed that under all conditions, the Joint Interface of aluminum 5083 - aluminum 1050 exhibited a flat and defect-free structure. With increasing standoff distance, the Joint Interface of stainless steel 321 - aluminum 1050 transitioned from a smooth to a wavy pattern, and the average layer thickness increased from 4.95 μm to 6.7 μm. During heat treatment, the layer thickness in the Joint Interface increased proportionally to the diffusion kinetics, reaching maximum values of 18.56 μm and 15.02 μm for samples with standoff distances of 6.75 mm and 6 mm, respectively. The activation energies for diffusion were calculated as 46.6 kJ/mol and 42.4 kJ/mol, and the diffusion constants were 142.2 ms-1  and 45.3 ms-1 for the same samples.

In today's technological landscape, the push for miniaturization in electronic devices is greater than ever, driven by technological advancements.The challenges of electromigration and thermomigration
have arisen due to the need to establish new electronic connections under conditions characterized by creeping temperatures, originating from the low melting point of solders and high current density.  Therefore, recently, alloying and composite materials have been employed to enhance the resistance of electronic connections to electromigration. In this study, efforts to enhance the resistance to electromigration using a composite SAC0307 lead-free solder alloy incorporating cobalt microparticles. The presence of cobalt in the intermetallic composition of the interface causes more stability of the intermetallic composition of the interface and prevents the reduction of the thickness of the intermetallic composition of the interface during the time of the electromigration test; As a result, the stability and electronic connection of the sample soldered with composite solder alloy is more than that of non-composite solder alloy. On the other hand, due to the fine grain structure and the increase in grain boundary density in the composite solder alloy, the lattice diffusion mechanism in the non-composite solder alloy has been changed to the grain boundary diffusion mechanism; As a result, due to the consumption of copper atoms flowed from the cathode side to the anode by the intermetallic compounds present in the grain boundaries, non-uniform microstructural was observed in the composite solder alloy during the time of electromigration test.

In this research, the transient liquid phase bonding of St52 carbon steel to WC-Co cermet using a copper interlayer with 50 μm thickness was done. For this purpose, samples were jointed to each other at a constant temperature of 1100 ºC and bonding times of 1, 15, 30, and 45 min. The microstructure of the joints was examined using an optical microscope and scanning electron microscope equipped with energy-dispersive X-ray spectroscopy. XRD analysis was also used to investigate the effect of bonding on the phase changes of the bonding area. Microhardness and tensile shear tests were also conducted to study the mechanical properties of the samples. Microstructural investigations showed the formation of three different zones including isothermal and athermal solidification zones and DAZ in the WC-Co base material side, which determine the characteristics of the samples. The isothermal solidification zone contained a Fe-rich solid solution and the athermal solidification zone contained a Cu-rich solid solution. η phase was not formed in the DAZ of WC-Co cermet at bonding times of 1 and 15 min. This phase was formed in the DAZ of WC-Co cermet by increasing the bonding time to 30 and 45 min. The microhardness studies showed that all samples had the same trend. Maximum microhardness was 1100 HV which was related to WC-Co base cermet and the lowest microhardness was about 220 HV which was related to steel base metal. Also, the maximum tensile-shear strength of the bonded samples was about 180 MPa for a bonded sample at a bonding time of 15 min, which was due to the increase in the volume fraction of iron-rich solid solution, as well as proper microstructural continuity and the presence of an optimal amount of copper-rich phase in the microstructure.

The dissimilar joint of alumina to copper with active filler metals Ag-Cu-Ti-Sn and Ag-Cu-Ti-Sn-%3.5Zr were done using the induction brazing process at temperatures of 840 and 860 ℃ for 15 minutes. The microstructures of joints were evaluated using optical microscope (OM) and scanning electron microscope (SEM). Vickers hardness test and shear tensile strength test were used to evaluate the mechanical properties. The results of the microstructural studies showed that the Al2O3/Cu joints using Ag-Cu-Ti-Sn and Ag-Cu-Ti-Sn-%3.5Zr fillers contain a reaction layer at the interface between alumina and the filler metal. At the area of the reaction layer with Ag-Cu-Ti-Sn filler metal, two TiO and Cu3Ti3O phases were observed, and also at the reaction layer with Ag-Cu-Ti-Sn-%3.5Zr filler metal, two TiO and ZrO2 phases were observed. The results of the shear strength test showed that due to the greater thickness of the filler metal and the lower thickness of the reaction layer, the joint with the filler metal Ag-Cu-Ti-Sn-%3.5Zr (14 MPa) has a higher shear strength as compared with the joint with filler metal Ag-Cu-Ti- Sn (9 MPa).