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Showing 3 results for Kokabi
Evaluation of microstructure and mechanical properties of 410NiMo as an overlay layer on low alloy steel
H. Ghasemi Tabasi, A. H. Kokabi,
Volume 2, Issue 2 (Journal OF Welding Science and Technology of Iran 2016)
Abstract

The aim of this study is to reach an increased service life for parts using in sour environment by weld overlaying process. In this investigation, two successive layers of ER410NiMo were clad on low alloy steel substrates. To reduce the likelihood of Hydrogen Induced Cracking (HIC) and producing stable hydrogen traps, Post Weld Heat Treatment (PWHT) was conducted. Microstructural analysis, X-ray diffraction studies, and mechanical tests show significant increase for austenite volume fraction after second stage of PWHT. In fact, not only two-stage PWHT  reduce the samples hardness, but it also increases austenite volume fraction which is a more resistant microstructure against hydrogen cracking.


Investigation of microstructure and physical properties in nanocomposite solder reinforced with various percent of graphene nanosheets (SAC0307+GNSs)
S. Azghandirad, M. Movahedi, A. Kokabi, M. Tamizi,
Volume 8, Issue 1 (Journal OF Welding Science and Technology 2022)
Abstract
Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions have been proposed to replace Sn-Pb solders. As a lead-free solder alloy, low melting point, high reliability, and compatibility with various fluxes are among the properties of this category of alloys. In order to improve the properties of the joint, these solders are sometimes reinforced with different nanoparticles. In this study, Sn0.3Ag0.7Cu compound reinforced with graphene nanosheets with different weight percentages (0, 0.05, 0.1, and 0.2) was studied. Microstructure of the alloys was investigated by scanning electron microscopy(SEM) and optical microscopy. Melting temperature, wetting behavior and electrical resistivity of the solders were evaluated. According to the results, by adding graphene nanosheets, the wetting angle of the solder first decreased and then increased. This parameter showed the optimal amount for sample containing %0.1 graphene nanosheets with a %10 reduction. The melting point and electrical resistance of the solder alloy did not change significantly with compositing. With the addition of graphene nanosheets, the thickness of the intermetallic compounds Cu6Sn5 present at the interface between copper and solder was reduced up to %30.
 

Investigation of microstructure and mechanical properties of lead free composite solder containing cobalt microparticles produced by accumulative roll bonding
M.h. Nourmohammadi, M. Movahedi, A.h. Kokabi, M. Tamizi,
Volume 9, Issue 1 (Journal OF Welding Science and Technology 2023)
Abstract
The miniaturization and compaction trends in electronic equipment and the removal of lead (Pb) element from solder alloys due to environmental considerations have created a great challenge in the field of designing and developing of new solder alloys. Therefore, researchers have recently focused on composite solder alloys using reinforcing particles to improve the reliability of lead-free solders. In this research, SAC0307 solder alloys (99 wt.% Sn, 0.3 wt.% Ag, and 0.7 wt.% Cu) with different percentages of cobalt microparticles were made by the Accumulative Roll Bonding (ARB) method. Then, the effect of the particles on wettability, microstructures and mechanical characteristics of solder alloys was investigated. The lowest contact angle was 23◦in 0.2 wt.% cobalt sample. By adding cobalt to the solder matrix, the size of intermetallic compounds (IMCs), Cu6Sn5 and Ag3Sn, decreased and the percentage of eutectic phases increased. The shape of the interfacial intermetallic compounds changed from scallop to layer shape by adding cobalt, and their average thickness increased about 13-71% in composite samples. The shear strength of solders increased up to 38% by enhancement of cobalt microparticles in the solder alloy containing 0.4 wt.% cobalt; however, shear strength was decreased in the composite solder containing 1 wt.% cobalt due to the agglomeration of microparticles. The shear fracture surfaces showed that the nature of the fracture changed from ductile fracture in the form of elongated dimples to brittle fracture in the form of cleavage with the increase in the percentage of cobalt microparticles. The composite solder alloys containing 0.2-0.4 wt.% Co have the best wettability behavior and tensile shear strength.

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