Showing 7 results for Intermetallic Compound
S. Asadi, T. Saeid, A. Valanezhad, J. Khalil Allafi,
Volume 5, Issue 2 (1-2020)
Abstract
In this research, dissimilar welding of NiTi shape memory alloy to AISI 304 austenitic stainless steel Archwires was investigated. For this purpose, common straight orthodontic archwire with rectangular cross-section and dimensions of (0.635 × 0.432 mm) were selected and the laser welding technique was used to connect the wires. The microstructure, chemical composition and phasesin the weld zone of the joints werestudied with Optical microscopy (OM), Scanning electron microscopy (SEM) equipped with EDS analysis system, focused X-ray diffraction (Micro-XRD).Also, the mechanical properties of the weld zone were investigated by using Vickers microhardness test. Microstructure investigation showed that the obtained microstructure from the laser weld of these alloys has a dendritic and non-homogeneous structure. According to XRD analysis, brittle intermetallic compounds such as Fe2Ti, Cr2Ti, TiNi3, and Ti2Ni wereformed during laser welding in the weld zone. Formation of these brittle intermetallics caused increasing the hardness of the weld zoneabout 800 HV. and decreasing the mechanical properties. Also, Fe2Ti intermetallic particles mainly formed in the weld region near the NiTi fusion zone which results in stress concentration, micro-cracks formation and dropping joints mechanical properties. Therefore, a suitable modification process is required to control the chemical composition of the weld zone and improving the joint properties of dissimilar laser welded archwires of these alloys.
S. Azghandirad, M. Movahedi, A. Kokabi, M. Tamizi,
Volume 8, Issue 1 (8-2022)
Abstract
Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions have been proposed to replace Sn-Pb solders. As a lead-free solder alloy, low melting point, high reliability, and compatibility with various fluxes are among the properties of this category of alloys. In order to improve the properties of the joint, these solders are sometimes reinforced with different nanoparticles. In this study, Sn0.3Ag0.7Cu compound reinforced with graphene nanosheets with different weight percentages (0, 0.05, 0.1, and 0.2) was studied. Microstructure of the alloys was investigated by scanning electron microscopy(SEM) and optical microscopy. Melting temperature, wetting behavior and electrical resistivity of the solders were evaluated. According to the results, by adding graphene nanosheets, the wetting angle of the solder first decreased and then increased. This parameter showed the optimal amount for sample containing %0.1 graphene nanosheets with a %10 reduction. The melting point and electrical resistance of the solder alloy did not change significantly with compositing. With the addition of graphene nanosheets, the thickness of the intermetallic compounds Cu6Sn5 present at the interface between copper and solder was reduced up to %30.
M. Naseri Alenjagh, T. Saeid,
Volume 9, Issue 1 (5-2023)
Abstract
The purpose of this research is to investigate the change of rotational speed and traverse speed on the microstructure and mechanical properties of the joint in friction stir welding of aluminum 1050 and 316L stainless steel. For this purpose, the microstructure, thickness of intermetallic compounds, hardness and tensile test on the joint were investigated. The proper selection of welding parameters leads to the creation of a joint with suitable metallurgical and mechanical properties. In this research, two rotational speeds of 560 and 900 rpm and four traverse speeds of 60, 80, 100 and 125 mm/min were performed. The microstructure consisted of four areas of the base metal, heat affected zone, thermo-mechanical affected zone and stir zone. In all the samples, the stir zone (SZ) contained a recrystallization microstructure with fine equiaxed grains. According to the Energy dispersive X-ray Spectroscopy results, an IMC layer formed in the joint interface. The hardness of the stir zone in all samples was higher than the aluminum base metal due to the formation of recrystallization fine equiaxed grains and the presence of steel particles. The best sample in terms of mechanical properties, mocrostructure and joint quality was obtained in the conditions of rotation speed of 900 rpm and advance speed of 125 mm/min. The strength was equal to 84 MPa with 77% efficiency.
M.h. Nourmohammadi, M. Movahedi, A.h. Kokabi, M. Tamizi,
Volume 9, Issue 1 (5-2023)
Abstract
The miniaturization and compaction trends in electronic equipment and the removal of lead (Pb) element from solder alloys due to environmental considerations have created a great challenge in the field of designing and developing of new solder alloys. Therefore, researchers have recently focused on composite solder alloys using reinforcing particles to improve the reliability of lead-free solders. In this research, SAC0307 solder alloys (99 wt.% Sn, 0.3 wt.% Ag, and 0.7 wt.% Cu) with different percentages of cobalt microparticles were made by the Accumulative Roll Bonding (ARB) method. Then, the effect of the particles on wettability, microstructures and mechanical characteristics of solder alloys was investigated. The lowest contact angle was 23◦in 0.2 wt.% cobalt sample. By adding cobalt to the solder matrix, the size of intermetallic compounds (IMCs), Cu6Sn5 and Ag3Sn, decreased and the percentage of eutectic phases increased. The shape of the interfacial intermetallic compounds changed from scallop to layer shape by adding cobalt, and their average thickness increased about 13-71% in composite samples. The shear strength of solders increased up to 38% by enhancement of cobalt microparticles in the solder alloy containing 0.4 wt.% cobalt; however, shear strength was decreased in the composite solder containing 1 wt.% cobalt due to the agglomeration of microparticles. The shear fracture surfaces showed that the nature of the fracture changed from ductile fracture in the form of elongated dimples to brittle fracture in the form of cleavage with the increase in the percentage of cobalt microparticles. The composite solder alloys containing 0.2-0.4 wt.% Co have the best wettability behavior and tensile shear strength.
Dr Mojtaba Movahedi, Dr Amir Hossein Kokabi, Engineer Mohammad Hadi Nourmohammadi,
Volume 9, Issue 2 (8-2024)
Abstract
Soldering plays a crucial role in the electronics industry, driving the need for constant improvements in physical and mechanical properties and the management of intermetallic compound formation. Research in composite materials aims to achieve a uniform distribution of reinforcing particles within solder matrices to enhance their performance. This study investigates the integration of cobalt microparticles into SAC0307 lead-free soft solder alloy using the accumulative roll bonding (ARB) method. Microstructural analysis confirmed a homogeneous dispersion of cobalt particles within the solder after three ARB passes. Moreover, increasing cobalt content led to a reduction in the size of Cu6Sn5 intermetallic compounds, from 9 µm to 5 µm with 1% cobalt by weight. Examination of β-Sn grain morphology revealed the impact of cobalt particles on recovery and recrystallization kinetics in the solder. Mechanical testing indicated a 20% decrease in interlayer strength within composite solder sheets. Tensile tests showed a 28% increase in strength and a 31% decrease in elongation for composite solder alloy containing 1% cobalt. Differential scanning calorimetry (DSC) results revealed minimal change in the melting temperature of composite solder foil
Mr E. Ganjeh, Dr Ali Kaflou, Dr Kourosh Shirvani,
Volume 9, Issue 2 (1-2024)
Abstract
In this study, mechanical properties of the transient liquid phase (TLP) bonds between Hastelloy X to Ni3Al IMC at temperature range of 800 - 900 °C were investigated. The microstructure of the joints was examined by optical and scanning electron microscopy. Also, high temperature XRD (HTXRD) analysis was utilized to investigate the phase changes at different temperatures of half-joints. According to microscopic observations, the joint cross-section consisted of three regions including diffusion affected zone (DAZ), isothermal solidification zone (ISZ), and Athermal solidification zone (ASZ), which increasing temperature and time result in ISZ consisting of nickel-rich solid solution developed across the microstructure. The optimum joint bonding strength was achieved for the sample treated at 1100 °C – 180 min equal to 355 ± 4.5 MPa. The ultimate tensile strength reached 36.5 ± 1 and 20.5 ± 1 MPa at temperatures of 800 °C and 900 °C, respectively. Fracture occurred on the side of the IMC substrates at both test temperatures due to the presence of shrinkage porosity during the solidification stage of IMC and crystal lattice parameters mismatch with the matrix.
Engineer M. H. Nourmohammadi, M. Movahedi, A. H. Kokabi ,
Volume 10, Issue 1 (6-2024)
Abstract
In today's technological landscape, the push for miniaturization in electronic devices is greater than ever, driven by technological advancements.The challenges of electromigration and thermomigration
have arisen due to the need to establish new electronic connections under conditions characterized by creeping temperatures, originating from the low melting point of solders and high current density. Therefore, recently, alloying and composite materials have been employed to enhance the resistance of electronic connections to electromigration. In this study, efforts to enhance the resistance to electromigration using a composite SAC0307 lead-free solder alloy incorporating cobalt microparticles. The presence of cobalt in the intermetallic composition of the interface causes more stability of the intermetallic composition of the interface and prevents the reduction of the thickness of the intermetallic composition of the interface during the time of the electromigration test; As a result, the stability and electronic connection of the sample soldered with composite solder alloy is more than that of non-composite solder alloy. On the other hand, due to the fine grain structure and the increase in grain boundary density in the composite solder alloy, the lattice diffusion mechanism in the non-composite solder alloy has been changed to the grain boundary diffusion mechanism; As a result, due to the consumption of copper atoms flowed from the cathode side to the anode by the intermetallic compounds present in the grain boundaries, non-uniform microstructural was observed in the composite solder alloy during the time of electromigration test.
