Showing 4 results for Transient Liquid Phase Bonding
S. Ghaderi, F. Karimzadeh, A. Ashrafi,
Volume 5, Issue 2 (1-2020)
Abstract
In the present study, the effect of time and base metal microstructure on the Transient Liquid Phase (TLP) bonding of 304L stainless steel was studied. TLP was performed at 1050 0C for 5 and 60 minutes on the coarse grain austenitic and martensitic microstructure using BNi-2 interlayer. To prepare martensitic microstructure, as-received 304L was rolled at -15 0C up to 80% rolling reduction. TEM analysis was proved that the microstructure of 80% rolled samples consisted of two different morphologies of martensite namely as lath-type and dislocation cell type martensite. It was observed that the structure of bonded zone after 5 min has consisted of isothermally solidified zone (ISZ) containing γ solid solution and athermally solidified zone (ASZ) containing complex boride phases. Meanwhile, after 60 min of heating, the structure of bonded zone completely solidifies isothermally. The obtained results also showed that the martensitic microstructure considerably effect on the width of diffusion affected zone (DAZ) which was related to the reversion of martensite to ultrafine grain austenite during heating.
S. A. Beheshti Bafqi, M. Mosallaee,
Volume 6, Issue 2 (12-2020)
Abstract
In the present study, the transient liquid phase bonding of AISI 2205 dual phase stainless steel with amorphous BNi-3 interlayer was carried out. Based on the initial experimental and analytical studies, the parameters of temperature and bonding time were determined. In order to investigate the effect of bonding temperature on the microstructural changes of the joint, bonding was performed in the temperature range of 1050-1200℃ for 20 min. The microstructural and phase analyses indicated the completion of isothermal solidification and the formation of a uniform Ni-solid solution in the bonding zone centerline. The interdiffusion between the bonding zone and the adjacent base metal resulted in the formation of boride and nitride intermetallic compounds in the base metal adjacent to the bonding zone, which the area fraction of this intermetallics significantly decreased with increasing bonding temperature from 1050℃ to 1200℃ (reduction of the intermetallic area fraction from 85% to 40%). Evaluation of shear strength of samples showed that despite the completion of isothermal solidification in all samples and shear strength of bonded samples significantly depends of amount and morphology of intermetallic compounds on the transient liquid phase bonding shear strength. By increasing the bonding temperature to 1200℃ and reducing the area fraction of intermetallic compounds up to 40% of the shear strength of the samples increased from 450 MPa of TLP bonded specimen of 1050℃ to about 85% of base metal shear strength.
Dr Behzad Binesh, Dr Sima Mirzaei, Mr Amin Taghi-Ahari,
Volume 7, Issue 2 (1-2022)
Abstract
Transient liquid phase (TLP) bonding of AISI 304L stainless steel was carried out using BNi-2 amorphous interlayer. The microstructure of the joint area was studied by using optical and scanning electron microscopes and energy dispersive spectroscopy. The effect of bonding temperature (1030-1110 °C) was studied on the microstructure and corrosion behavior of the TLP bonded samples. Electrochemical corrosion resistance of the bonded samples was evaluated in 3.5% NaCl solution at room temperature. The mechanism of the microstructure formation and the solidification sequence at the joint area were discussed. Ni- and Cr-rich borides, Ni-Si-B compound and fine Ni3Si particles were identified in the γ-Ni matrix at the joint centerline. The microstructural investigations revealed that the solidification sequence of these phases is: L→ γ + L → γ + Ni boride + Cr boride + L → γ + Ni boride + Cr boride + Ni-Si-B Compound. The highest corrosion resistance was observed in the sample bonded at 1070 °C for 30 min, which is comparable to that of the as-received AISI 304L stainless steel. It was attributed to the bond region microstructure with a negligible amount of eutectic constituents formed in the athermally solidified zone.
Behnam Heidari-Dehkordi, Mahdi Rafiei, Mahdi Omidi, Mohsen Abbasi-Baharanchi,
Volume 9, Issue 2 (8-2024)
Abstract
In this study, 316L stainless steel and WC-10Co cermet were bonded by transient liquid phase process with BNi-2 interlayers with different thicknesses of 25 and 50 μm. The bonding process was conducted at 1050 °C for 1, 15, and 30 min. After bonding, the microstructure of the joints was examined using optical microscopy and scanning electron microscopy equipped with energy-dispersive X-ray spectroscopy. Microhardness and tensile-shear tests were also performed to study the mechanical properties of the bonded samples. Microstructural analyses revealed that the formation mechanism of the solidified region in all samples was isothermal solidification, resulting in an isothermal solidification zone upon bonding. Additionally, the only phase present in the isothermal solidification zone was a nickel-based solid solution. In the diffusion-affected zone of the steel base material, complex borides formed regardless of the interlayer thickness. In the diffusion-affected zone of the WC-Co material, a brittle eta phase formed. Microhardness tests indicated that the maximum hardness in all samples was approximately 1100 Vickers, which was attributed to the presence of hard WC particles in the WC-Co base material. Furthermore, the highest tensile-shear strength, approximately 240 MPa, was observed in the bonded sample for 15 min with 50 μm thickness interlayer.
