A. Izadpanahi, M. Mahdavi Shahri, M.s. Abravi,
Volume 5, Issue 1 (9-2019)
Abstract
This paper introduces a novel soldering method for joining aluminum foams to aluminum plates. In this method, a rotating aluminum plate is soldered to the aluminum foam using zinc-based solder material. Rotation of the aluminum plate over the solder material drags the solder material and stirring it. Excellent tensile strength was obtained compared to those samples that are welded with the soldering flux but with no rotation involved. It was concluded that the stirring of the zinc-based solder material in the liquid state and just before the solidification break the oxide layers and help the wetting process done. Scanning electron microscope examinations showed diffusion has occurred between the solder alloy both the aluminum foam and the aluminum plate.
