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Showing 2 results for Reaction Layer

I. Saydi, R. Dehmolaei, Kh. Ranjbar,
Volume 8, Issue 1 (8-2022)
Abstract

In this research, the diffusion bonding of the stabilized zirconia ceramic and Nimonic 105 superalloy using Ti/Nb/Ni multi-interlayer was carried out. Joint was performed using the plasma spark technique in a vacuum atmosphere and at different temperatures and times. The microstructure of the different joint zones was studied using optical and FESEM microscopes equipped with an EDS analyzer. The results showed that the critical region is Ti/3YSZ interface and in all conditions diffusion bonding in Ti/Nb, Nb/Ni, and Ni/NI 105 interfaces were done. Microstructural observations showed that in the Ti/3YSZ interface at all temperature and time conditions, the connection of two separate regions including Ti3O and (Zr, Ti)2O was formed due to the difference in the diffusion depth of Ti, Zr, and O elements and with increasing temperature and time, the thickness of these regions increased. Microstructural studies showed that the bond at 900  and 30 minutes did not have any cracks and discontinuities and due to the better diffusion of atoms, a suitable reaction layer was formed. Microhardness observations and EDS analyses confirmed that the Ti3O reaction layer is the weakest zine.

A. Pourjafar, R. Dehmolaei, R. Alavi Zaree, Kh. Ranjbar, M.r. Tavakoli Shoushtari,
Volume 8, Issue 2 (1-2023)
Abstract

In this study, the effect of temperature on the microstructure and reactive layer at the interface between the Ti interlayer and the base metal related to the diffusion bonding of Zr702 to A516 low alloy steel was investigated. The joining was done using the spark plasma sintering technique at temperatures of 900, 950 and 1000°C for 30 minutes. Field Emission Scanning Electron Microscope (FESEM) equipped with EDS analysis was used to investigate the microstructure of the interfaces in various joints. Investigations showed that at all temperatures, with the diffusion of atoms and the formation of a reactive layer between the Ti interlayer and Zr702, no intermetallic phases, cracks, porosity and discontinuities were formed at their interfaces. . It was found that increasing the bonding temperature did not cause the formation of new phases and compounds in the interface and only increased the thickness of the reaction layer. The measurement of the thickness of the reactive layer showed that the maximum and minimum amounts of diffusion were 84 microns at 1000 °C and 64 microns at 900 °C respectively


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