Journal of Advanced Materials in Engineering (Esteghlal)

In this study, the formation of the Al₃Ti intermetallic compound at the junction interface of aluminum-titanium was investigated during deposition and annealing. The results illustrated that during the deposition process, one thin layer of Ti₃Al₂ intermetallic compound was created at the junction interface. During the annealing at 550 °C, this layer was transformed to the  Al₃Ti intermetallic phase and the layer growth occurred. By performing annealing at higher temperatures, the growth rate of Al₃Ti intermetallic layer was increased; at the same time, the formation of Kirkendall cavities and  coupling in the cavities and fragmentation of diffusional coupling from the junction with aluminum were observed